UW-Stout packaging program to host international student-led conference

Student members of the Stout Packaging Association stand together. | Credit: UW-Stout

“For three days in April, students from packaging universities and colleges in the U.S. and Canada will connect with industry professionals and alumni to showcase the impact that packaging has on the world.

University of Wisconsin-Stout’s Stout Packaging Association student members will host Packaging Jamboree 2024, or Pack Jam, an annual student-led conference, from Sunday, April 7, to Tuesday, April 9.

‘Pack Jam gives students the benefits of collaborating in competition; networking with students from different universities, industry professionals and alumni; and learning about current industry trends and career opportunities,’ said packaging Program Director Min DeGruson.

Schools that traditionally attend are Clemson University, Dunwoody College of Technology, Hennepin Technical College, Michigan State University, Northwood Technical College, Rochester Institute of Technology, Virginia Tech, Rutgers University, Toronto Metropolitan University and more.

Registration is open through Monday, March 25.”

Quote from www.packagingimpressions.com